Wangikar SS, Patowari PK, Misra RD (2018) Parametric optimization for photochemical machining of copper using overall evaluation criteria. In 1st techno-societal, international conference on advanced technologies for societal applications. Wangikar SS, Patowari PK, Misra RD (2016) Parametric optimization for photochemical machining of copper using grey relational method. Gidde RR, Pawar PM, Ronge BP, Shinde AB, Misal ND, Wangikar SS (2019) Flow field analysis of a passive wavy micromixer with CSAR and ESAR elements. Wangikar SS, Patowari PK, Misra RD (2018) Numerical and experimental investigations on the performance of a serpentine microchannel with semicircular obstacles. J Manuf Processĭas SS, Tilekar SD, Wangikar SS, Patowari PK (2017) Numerical and experimental study of passive fluids mixing in micro-channels of different configurations. Manoharan S, Summerville S, Freiberg L, Coblyn M, Touma JG, Jovanovic G, Paul BK (2020) Manufacturing process design of a micro-scale liquid-liquid extractor and multi-phase separator. Mazarbhuiya RM, Rahang M (2020) Parametric study of photochemical machining of aluminium using taguchi approach. Jadhav Saurabh M, Karatkar Onkar V, Bangale Kamesh N, Choudhari Deepak B, Utpat AA, Kamble Banduraj K (2019) Etching depth variation of brass material for different operating conditions. Kamble B, Utpat A, Misal ND, Ronge BP (2019) 3D Photochemical machining of copper by using colored phototools. J Mater Process Technol 149(1–3):238–245īruzzone AAG, Reverberi AP (2010) An experimental evaluation of an etching simulation model for photochemical machining. J Mater Process Technol 175:63–68Īllen DM, Almond HJ (2004) Characterisation of aqueous ferric chloride etchants used in industrial photochemical machining. Adv Mater Res 548:617–622Ĭakir O (2006) Copper etching with cupric chloride and regeneration of waste etchant. Saraf AR, Misal ND, Sadaiah M (2012) Mathematical modelling and optimization of photo chemical machining. Misal ND, Saraf AR, Sadaiah M (2017) Experimental investigation of surface topography in photo chemical machining of Inconel 718. Misal ND, Sadaiah M (2017) “Investigation on surface roughness of inconel 718 in photo chemical machining”. In proceedings of the ASME 2015 international manufacturing science and engineering conference MSEC2015, Charlotte, North Carolina, USA. Sadaiah M, Patil DH (8–) Some investigations on surface texturing on monel 400 using photochemical machining. In 2007 proceedings 57th electronic components and technology conference. Jang DM, Ryu C, Lee KY, Cho BH, Kim J, Oh TS, Yu J et al (May 2007) Development and evaluation of 3-D SiP with vertically interconnected through silicon vias (TSV). Mater Manuf Process 32(15):1747–1755Īgrawal D, Kamble D (2019) Optimization of photochemical machining process parameters for manufacturing microfluidic channel. Wangikar SS, Patowari PK, Rahul DM (2017) Effect of process parameters and optimization for photochemical machining of brass and german silver. Keywordsĭavis PJ, Overturf GE III (1986) Chemical machining as a precision material removal process. The cartridge brass has been widely used in industrial applications. This article is focused on the study of etching depth and surface roughness of cartridge brass material at different time and temperature. The effect of process parameters is changing by changing composition of material. Very few literatures are available on an alloy of copper and brass. The study of copper and brass were reported by many researchers. The etching depth and surface roughness of material increases with increase in time and temperature. The objective of this study is to achieve etching depth on the Cartridge brass plate having thickness 0.5 mm. The process parameters are etching temperature and time and responses are etching depth and surface roughness. In this work, the cartridge brass was selected as a base metal which has good electrical and thermal conductivity. The very precision parts such as microchannels, heat sinks, Fine mesh or screens and printed circuit boards are developed by this process. The micro level etching of components of different materials is carried out by using chemical etching process. Now a days to produce stress free and burr free micro components, photochemical machining is one of the emerging technologies.
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